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PMEG4002EL
40 V, 0.2 A low VF MEGA Schottky barrier rectifier
Rev. 02 -- 11 March 2009 Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD882 leadless ultra small Surface-Mounted Device (SMD) plastic package.
1.2 Features
I I I I I Forward current: IF 0.2 A Reverse voltage: VR 40 V Low forward voltage Leadless ultra small SMD plastic package Power dissipation comparable to SOT23
1.3 Applications
I I I I I I Ultra high-speed switching Voltage clamping Protection circuits Low voltage rectification Blocking diodes Low power consumption applications
1.4 Quick reference data
Table 1. Symbol IF VR Quick reference data Parameter forward current reverse voltage Conditions Min Typ Max 0.2 40 Unit A V
NXP Semiconductors
PMEG4002EL
40 V, 0.2 A low VF MEGA Schottky barrier rectifier
2. Pinning information
Table 2. Pin 1 2 Pinning Description cathode anode
[1]
Simplified outline
Graphic symbol
1 2
sym001
1
2
Transparent top view
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 3. Ordering information Package Name PMEG4002EL Description leadless ultra small plastic package; 2 terminals; body 1.0 x 0.6 x 0.5 mm Version SOD882 Type number
4. Marking
Table 4. Marking Marking code F4 Type number PMEG4002EL
5. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VR IF IFRM IFSM Tj Tamb Tstg
[1]
Parameter reverse voltage forward current repetitive peak forward current non-repetitive peak forward current junction temperature ambient temperature storage temperature
Conditions
Min -
Max 40 0.2 1 3 150 +150 +150
Unit V A A A C C C
tp 1 ms; 0.25 square wave; tp = 8 ms
[1] [1]
-65 -65
For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. Nomograms for determining the reverse power losses PR and IF(AV) rating are available on request.
PMEG4002EL_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 11 March 2009
2 of 8
NXP Semiconductors
PMEG4002EL
40 V, 0.2 A low VF MEGA Schottky barrier rectifier
6. Thermal characteristics
Table 6. Symbol Rth(j-a)
[1] [2]
Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air
[1][2]
Min -
Typ -
Max 500
Unit K/W
Refer to SOD882 standard mounting conditions (footprint), FR4 Printed-Circuit Board (PCB) with 60 m copper strip line. For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. Nomograms for determining the reverse power losses PR and IF(AV) rating are available on request.
7. Characteristics
Table 7. Characteristics Tamb = 25 C unless otherwise specified. Symbol VF Parameter forward voltage Conditions IF = 0.1 mA IF = 1 mA IF = 10 mA IF = 100 mA IF = 200 mA IR reverse current VR = 25 V VR = 40 V Cd
[1]
[1]
Min
Typ 190 250 320 440 520 0.3 0.7 14
Max 220 290 360 500 600 0.5 10 20
Unit mV mV mV mV mV A A pF
diode capacitance
Pulse test: tp 300 s; 0.02.
VR = 1 V; f = 1 MHz
PMEG4002EL_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 11 March 2009
3 of 8
NXP Semiconductors
PMEG4002EL
40 V, 0.2 A low VF MEGA Schottky barrier rectifier
103 IF (mA) 102
001aaa337
104 IR (A) 103
001aaa338
(1) (2)
102
(3) (1) (2) (3) (4)
10
10
1 1 10-1 10-1 0 200 400 VF (mV) 600 10-2 0 10 20 30 VR (V) 40
(4)
(1) Tj = 150 C (2) Tj = 125 C (3) Tj = 85 C (4) Tj = 25 C
(1) Tj = 150 C (2) Tj = 125 C (3) Tj = 85 C (4) Tj = 25 C
Fig 1.
Forward current as a function of forward voltage; typical values
30 Cd (pF) 20
Fig 2.
Reverse current as a function of reverse voltage; typical values
001aaa339
10
0 0 10 20 30 VR (V) 40
f = 1 MHz; Tamb = 25 C
Fig 3.
Diode capacitance as a function of reverse voltage; typical values
PMEG4002EL_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 11 March 2009
4 of 8
NXP Semiconductors
PMEG4002EL
40 V, 0.2 A low VF MEGA Schottky barrier rectifier
8. Package outline
0.62 0.55 2
0.50 0.46
0.30 0.22
0.65 0.30 0.22 0.55 0.47 Dimensions in mm
1.02 0.95
1
cathode marking on top side 03-04-17
Fig 4.
Package outline SOD882
9. Packing information
Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description 2 mm pitch, 8 mm tape and reel Packing quantity 10000 PMEG4002EL SOD882
[1]
-315
For further information and the availability of packing methods, see Section 13.
10. Soldering
1.3 0.7 R0.05 (8x)
solder lands solder resist solder paste occupied area 0.3 (2x) 0.4 (2x)
sod882_fr
0.9
0.6 0.7 (2x) (2x)
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Fig 5.
PMEG4002EL_2
Reflow soldering footprint SOD882
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 11 March 2009
5 of 8
NXP Semiconductors
PMEG4002EL
40 V, 0.2 A low VF MEGA Schottky barrier rectifier
11. Revision history
Table 9. Revision history Release date 20090311 Data sheet status Product data sheet Change notice Supersedes PMEG4002EL_1 Document ID PMEG4002EL_2 Modifications:
* * * * * *
The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Figure 4: superseded by minimized package outline drawing Section 9 "Packing information": added Section 10 "Soldering": added Section 12 "Legal information": updated Product data sheet -
PMEG4002EL_1
20040217
PMEG4002EL_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 11 March 2009
6 of 8
NXP Semiconductors
PMEG4002EL
40 V, 0.2 A low VF MEGA Schottky barrier rectifier
12. Legal information
12.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
12.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
PMEG4002EL_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 11 March 2009
7 of 8
NXP Semiconductors
PMEG4002EL
40 V, 0.2 A low VF MEGA Schottky barrier rectifier
14. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data. . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics. . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Packing information. . . . . . . . . . . . . . . . . . . . . . Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 2 2 2 2 3 3 5 5 5 6 7 7 7 7 7 7 8
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 11 March 2009 Document identifier: PMEG4002EL_2

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